Intel Boxed NUC Kit BOXNUC8I7HNK4 Intel Core i7-8705G Radeon RX Vega M Graphics

Specifications

Essentials- Product CollectionIntel NUC Kit with 8th Generation Intel Core Processors

• Code NameProducts formerly HADES CANYON
• StatusLaunched
• Launch DateQ1'18
• Board Form FactorUCFF (5.5" x 8")
• SocketSoldered-down BGA
• Internal Drive Form FactorM.2 SSD
• # of Internal Drives Supported2
• Lithography14 nm
• TDP65 W
• DC Input Voltage Supported19 VDC
• Processor IncludedIntel Core i7-8705G Processor with Radeon RX Vega M GL graphics (8M Cache, up to 4.10 GHz)
• Warranty Period3 yrs

Supplemental Information- Embedded Options AvailableNo

• DescriptionOther features: Includes 2x Thunderbolt 3 (40Gbps) via rear USB-C ports, SDXC card slot and front USB-A and USB-C ports w/ USB 3.1 Gen 2

Memory &; Storage- Max Memory Size (dependent on memory type)32 GB

• Memory TypesDDR4-2400+ 1.2V SO-DIMM
• Max # of Memory Channels2
• Max Memory Bandwidth38.4 GB/s
• Max # of DIMMs2
• ECC Memory Supported No

Processor Graphics- Integrated Graphics Yes

• Graphics Output2x Mini-DP 1.2, 2x Thunderbolt 3, F+R HDMI 2.0a
• # of Displays Supported 6
• Discrete GraphicsRadeon RX Vega M GL graphics

Expansion Options- PCI Express RevisionGen3

• PCI Express Configurations Dual M.2 slots with PCIe x4 lanes
• Removable Memory Card SlotSDXC with UHS-I support
• M.2 Card Slot (wireless)2230
• M.2 Card Slot (storage)22x42/80, 22x80

I/O Specifications- # of USB Ports13

• USB ConfigurationF: USB3, 2x USB 3.1g2 (Type A and C); R: 4x USB3, 2x Thunderbolt3 (USB3.1g2); INT: 2x USB2, 2x USB3
• USB Revision2.0, 3.0, 3.1 Gen2
• USB 2.0 Configuration (External + Internal)0 + 2
• USB 3.0 Configuration (External + Internal)1F, 4R, 2i
• Total # of SATA Ports2
• Max # of SATA 6.0 Gb/s Ports2
• RAID Configuration2x M.2 SATA/PCIe SSD (RAID-0 RAID-1)
• Audio (back channel + front channel)7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
• Integrated LAN2x 10/100/1000
• Integrated WirelessIntel Wireless-AC 8265 + Bluetooth 4.2
• Integrated BluetoothYes
• Consumer Infrared Rx SensorYes
• S/PDIF Out ConnectorTOSLINK
• Additional HeadersCEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL
• # of Thunderbolt 3 Ports2

Package Specifications- Low Halogen Options AvailableSee MDDS

Advanced Technologies- Intel Virtualization Technology for Directed I/O (VT-d) Yes

• Intel vPro Technology No
• TPMNo
• Intel HD Audio TechnologyYes
• Intel Rapid Storage TechnologyYes
• Intel Virtualization Technology (VT-x) Yes
• Intel Platform Trust Technology (Intel PTT)Yes

Security &; Reliability- Intel AES New InstructionsYes